Joining Semtech's PON-X lineup are a combo chip and a burst-mode TIA, designed for 2.5G PON Fiber to the Room (FTTR) ...

Swiss provider u-blox announced its first combined 3GPP-compliant terrestrial network (TN) and non-terrestrial network (NTN) ...

Achieving a high vertical accuracy depends on two factors: the number of ADC bits and the noise floor of the oscilloscope.

Battery management system (BMS) hardware and software continue to evolve as electric vehicles (EVs) transition to 800-V ...

Present day EVs have many shortcomings and while there are great efforts being made toward overcoming these, we ain’t there ...

Research shows on-chip liquid heatsinks exhibit 50 times greater cooling performance than conventional microchannels. Such ...

AI algorithm-based control system for automated driving facilitates more precise trajectory control in various driving ...

THine is set to debut an optical DSP-less chipset supporting PAM4 64-Gbps for PCIe 6.0 at this month’s ECOC 2024 exhibition ...

Sharp has built a state-of-the-art anechoic chamber in Japan to measure the performance of flat panel antennas for LEO and ...

Infineon has introduced 300-mm power GaN wafer technology within a scalable, high-volume manufacturing environment.

Faraday has unveiled an advanced packaging service that simplifies chiplet integration by coordinating various vendors and ...